Published: 05 Aug 2025 28 views
The Advanced Food Enginomics Research Scholarship supports commencing PhD students to conduct research into sensor for smart food packaging.
The scholarship will provide an annual stipend allowance equivalent to the University of Sydney's Research Training Program (RTP) stipend rate for up to three years, and is maintained through satisfactory academic performance. The recipient may apply for an extension of up to six months.
You must:
If you are applying for this scholarship as a supplementary scholarship, you must hold one of the following primary scholarships:
Apply for a Research Training Program Stipend Scholarship. Find out more information for domestic or international students.
You may apply for one or more of the two projects in sensor for smart food packaging. Please ensure you read the project description document (pdf, 134.7KB) for additional information.
For more information, kindly visit University of Sydney scholarship webpage.
A friend or someone might be interested in this opportunity, kindly share.