The USA Industry Placement Program Scholarship has been established to enrich the student experience and promote the international profile of this program.
Table of Content
Summary
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Benefits
This scholarship is valued at:
- $5000 for those awarded on academic merit and demonstrated leadership capabilites, or
- $7000 for those awarded on the basis of academic merit and financial need.
Requirements
You must:
- Be enrolled in a coursework degree at the University of Sydney Business School
- Have completed at least 24 credit points in your degree before commencing placement
- Be currently enrolled in BWIL2215 or BWIL6215
- Have a minimum Weighted Average Mark (WAM) of 70, unless you can demonstrate financial hardship, in which case a minimum WAM of 60 is required
- Undertake an approved unpaid placement during the semester.
Application Deadline
Not SpecifiedHow To Apply
For more details, visit University of Sydney Scholarship webpage
