Bond University Postgraduate Research Scholarship 2027

The Bond University Postgraduate Research Scholarship (BUPRS) supports high-achieving domestic and international doctoral students undertaking a PhD or Professional Doctorate at Bond University in Australia. It provides financial support through tuition-fee waivers and a living stipend, with applications assessed competitively based on academic merit and research potential.

Table of Content

• Summary
• Benefits
• Requirements
• Application Documents
• Application Deadline
• How To Apply

Summary

• Application DeadlineSeptember 30, 2026
• Study LevelPhD
• SponsorBond University
• City to studyQueensland
• School to studyBond University
• Eligible CountryAll Countries

Benefits

• The fee waiver for this scholarship is 100% of program fees for 4 years.
• The living stipend 2025 annual value is $34,315, indexed annually for a duration of 3 years. 

Requirements

• Before your scholarship application can be considered:

  • You must have a valid Bond University Letter of Offer for a PhD program or a Professional Doctorate of Occupational Therapy
  • You must be studying your program full time
  • If you have previously applied for a Higher Degree Scholarship at Bond University and were unsuccessful, you may submit one additional application for scholarship, outlining your change in circumstances. Applicants who are unsuccessful in their second application are ineligible to apply for future scholarship rounds. 

Application Documents

The following documents will form part of your scholarship application assessment:

• Research Project Proposal
• Academic Transcripts including the results/grades awarded, information on institution grading systems/scales, and evidence of completion
• Curriculum Vitae (CV) Please include any research publications and conference presentations
• Prize and Award Certificates
• Two referee reports

Scholarship applications cannot be accepted unless all required documents for assessment are uploaded to the application form.

Application Deadline

How To Apply

For more information, kindly visit the Bond University webpage.