Bond University values its higher degree research student cohort and provides a substantial level of direct financial support to many students. Bond University allocates funds to support the financial costs of fee offset (waiver) and living stipends.
Table of Content
Summary
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Benefits
- 100% of program fees for 4 years.
- Living stipend 2025 annual value is $33,511, indexed annually for a duration of 3 years.
Requirements
Before your scholarship application can be considered:
- You must have a valid Bond University Letter of Offer for a PhD program or a Professional Doctorate of Occupational Therapy
- You must be studying your program full time
- If you have previously applied for a Higher Degree Scholarship at Bond University and were unsuccessful, you may submit one additional application for scholarship, outlining your change in circumstances. Applicants who are unsuccessful in their second application are ineligible to apply for future scholarship rounds.
Application Documents
- Research Project Proposal
- Academic Transcripts including the results/grades awarded, information on institution grading systems/scales, and evidence of completion
- Curriculum Vitae (CV) Please include any research publications and conference presentations
- Prize and Award Certificates
- Two referee reports
Application Deadline
September 30, 2025How To Apply
Are you qualified and interested in this opportunity? Kindly go to
Bond University on forms.office.com to apply
Your scholarship application will not be accepted until you have received a valid Letter of Offer for admission to a doctoral research program from Bond University Admissions Department.
Some applications for admission can take up to 6 -10 weeks to complete. Ensure that you allow sufficient time to process your application for admission before the scholarship round closure date. Further information on how to apply for admission can be found on the Bond University Research Degrees webpage How to Apply.
For more information, kindly visit Bond University scholarship webpage.
