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Bond University MACC Undergraduate Excellence Scholarship 2025

In partnership with The Malaysian Australian Alumni Council, Bond University offers high academic achievers from Malaysia, who are applying to study at an undergraduate level for a bachelor's degree, with part-fee tuition remission scholarships.

Bond University - MACC* Undergraduate Excellence Scholarships are awarded on the basis of academic excellence and are a testament to Bond University’s commitment to quality and outstanding international students.

*Malaysia Australia Colombo Plan Commemoration. 

Table of Content

Summary

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Benefits

As a MACC Undergraduate Excellence Scholar, you will be awarded up to 50% tuition remission for any single undergraduate bachelor’s degree (excluding the Bond Medical Program) and will commence your study in either the May or September semester.

Requirements

To be eligible to apply for this scholarship, you must:

  • Be a citizen of Malaysia
  • Have achieved at least 6.5 overall and a minimum of 6.0 in each sub-band of the IELT's or equivalent test
  • Have achieved academic excellence in the top percentile from your high school qualification (for example, IB Diploma score of 38 or higher, minimum ATAR of 96) or equivalent
  • Not have already commenced undergraduate studies at Bond University

Application Documents

Application Deadline

Not Specified

How To Apply

Are you qualified and interested in this opportunity? Kindly go to Bond University on bond.edu.au to apply

Applications for this scholarship are made directly with the Malaysian Australian Alumni Council.

Applicants must complete the Bond University MACC Scholarship Application Form (Word document). Once complete, you must submit it along with supporting documents to MAAC for consideration.

Visit the MACC Scholarships website for further details on the application process, conditions and eligibility. 

You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered.

For more information, kindly visit Bond University scholarship webpage.

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